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EVG is a technology leader in wafer-level bonding and lithography for advanced packaging and nanotechnology. It offers high-volume production equipment and process solutions for manufacturing semiconductors, MEMS, compound semiconductors, power devices, and nanotechnology devices. The company manufactures wafer bonding, thin-wafer processing, lithography/nanoimprint lithography (NIL) equipment, photoresist coaters, cleaning, inspection/metrology systems, etc.